润芯微完成近亿元A轮融资,恒旭资本领投

2021-12-09

12月8日,智能出行解决方案公司「润芯微」(全称“润芯微科技(江苏)有限公司”)宣布已完成A轮融资,恒旭资本是本轮的领投方。本轮融资将用于公司高效并快速地实现自主研发车载软件领域的高端芯片和软件系统等先进技术、成果的落地,并依托国内外广阔的汽车终端消费市场需求,为公司高速、稳定发展创造有利的条件。本次领投润芯微是继地平线、经纬恒润、Momenta之后,恒旭资本围绕智能出行核心领域的又一次布局。

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润芯微作为科技创新型企业,不断突破和创新,积极推进“软硬件一体化+产品化”。公司将在成熟的智能终端业务基础上,秉持多元化发展和专业、共赢的理念,加强与车企的深度合作,不断对产品做出了更新迭代。向客户、用户、同行传递润芯微不断突破的创新精神,致力成为“软件定义汽车”的开创者。

恒旭资本帮助公司协调相城区人才及土地政策,助力公司全球总部顺利落户相城创新软件园,未来恒旭资本将帮助公司对接上汽集团业务,为公司发展提供了更多的选择,深度赋能企业发展。

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上汽集团金融事业部总经理吴珩表示:“当下对于汽车行业而言,以电动智能网联为主要特征的新动能,正在开启汽车工业百年未有之大变局。上汽集团坚持瞄准“电动化、智能网联化、共享化、国际化”新四化发展机遇,积极探索创新转型,为中长期可持续发展夯实基础。恒旭资本在这个时间点选择投资润芯微,正是看中公司拥有生态化的业务模型,强大的资源整合能力,以及跨界的软件能力栈和交付组织体系。相信在上汽集团强大的产业背景支持及赋能下,公司一定能快速成长为行业龙头企业。近年来,恒旭资本持续深耕苏州市,投资了天瞳威视、Momenta、瑞博生物、清陶能源、长风药业、硅谷数模、迪凯尔等众多优质企业。”

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Change of Address Notice


Dear investors and partners,


With your ongoing care and support, Hengxu Capital has achieved significant development and progress since its establishment. In order to better meet the needs of our business operations, our office location will be relocated to 5F, Building N3, New Bund Square City, No. 2, Lane 131, Qiantan Avenue, Pudong New District, Shanghai(Map Link: https://j.map.baidu.com/b5/x7VK).


The new office space is conveniently located with excellent facilities, providing improved conditions for meetings, receptions, and work. This relocation will facilitate better communication and collaboration between Hengxu Capital and our partners, enhancing employee satisfaction and office efficiency, and laying a solid foundation for continued and rapid business development.



The new office has been officially in use since January 29, and our mailing address has been switched to the new location. Considering the approaching Chinese New Year, we will not hold a relocation ceremony at the moment but plan to invite you to visit and guide us at a suitable time in the future.


If you have any questions or concerns, please feel free to contact us. Our phone numbers and email addresses remain unchanged. Once again, we appreciate your support and understanding, and we look forward to creating a brighter future together.


Shanghai SAIC Hengxu Capital Co., Ltd.


Jan. 29, 2024