2021-11-05
近日,专注于治疗神经系统疾病的创新药物公司“昌郁医药(上海)有限公司”(以下简称“昌郁医药”)宣布完成4000万美元C轮融资。本轮融资由恒旭资本、中信证券、高科新浚联合领投,沂景资本、金沙江联合润璞、道远资本共同参与,原股东平安创投继续追加投资。
昌郁医药成立于2015年底,拥有独特的耦合药物平台,通过多模式的治疗手段,专注于治疗神经系统疾病的创新药物。昌郁医药不仅提高产品疗效,更改进其安全性,最终取得最佳临床疗效,为患者提供更好、更安全和更有效的治疗药物。公司自主研发的XG005是一款拥有全球知识产权的非阿片类镇痛产品,不仅具备治疗炎性和神经疼痛的双效镇痛药物特点,同时还可改进目前一线非甾体抗炎药物的消化道副作用和降低神经疼痛产品的中枢神经副作用。
昌郁医药创始人兼首席执行官CEO徐景宏博士表示:“本轮融资的资金将继续开发基于昌郁医药专有耦合药物技术平台产生的原创双靶分子,包括首发产品XG005即将在美、中两地分别开展的III期及II期急性和慢性疼痛(包括肿瘤疼痛、骨关节疼痛)的临床实验、透皮产品XG004的II期海外临床,以及推进其他管线产品。在昌郁医药迈入下一个重要里程碑之际,我们非常感谢此轮新加盟的以及原有投资方的支持!感谢各方对昌郁医药的发展战略和创造长期价值的能力充满信心!昌郁医药将继续致力于为全球疼痛患者创造出更优化的治疗产品。”
联合创始人兼首席科学官CSO徐锋博士表示:“中国疼痛治疗现状远远落后于欧美国家,随着国内生活水平的日益改善,原有疼痛治疗手段已不能满足广大患者对生活品质的追求。在和监管部门的沟通中明确观察到中国老年性骨关节炎患者和带癌生存的患者人群急剧增大,但临床缺乏疗效好安全性佳的产品。昌郁医药将会针对此现状,加速肿瘤疼痛和慢性骨关节疼痛的临床开发速度,争取早日为患者提供优质产品!”
恒旭资本董事长陆永涛表示:“疼痛领域有长期未满足的临床需求,但限于研发难度巨大,多年未有疗效好且安全性高的新药问世。昌郁医药基于团队在疼痛领域的长期专研和成功药物研发经验以及独创的耦合平台,迅速将管线推进至美国的III期临床,实现产品管线迅速、持续地迭代,计划在中美两国开展多个验证性临床试验。恒旭资本认为,随着生活质量的提高,未来全球对于疼痛药物的需求必将进一步增加,能脱颖而出的一定是能兼具速度和效率的研发型公司,我们坚定看好昌郁的耦合平台和现有产品,以及未来在全球疼痛领域里的应用。”
上一篇: 恒旭资本投资纳米维景C轮融资
下一篇:德美医疗完成近1.5亿元E轮融资
Change of Address Notice
Dear investors and partners,
With your ongoing care and support, Hengxu Capital has achieved significant development and progress since its establishment. In order to better meet the needs of our business operations, our office location will be relocated to 5F, Building N3, New Bund Square City, No. 2, Lane 131, Qiantan Avenue, Pudong New District, Shanghai(Map Link: https://j.map.baidu.com/b5/x7VK).
The new office space is conveniently located with excellent facilities, providing improved conditions for meetings, receptions, and work. This relocation will facilitate better communication and collaboration between Hengxu Capital and our partners, enhancing employee satisfaction and office efficiency, and laying a solid foundation for continued and rapid business development.
The new office has been officially in use since January 29, and our mailing address has been switched to the new location. Considering the approaching Chinese New Year, we will not hold a relocation ceremony at the moment but plan to invite you to visit and guide us at a suitable time in the future.
If you have any questions or concerns, please feel free to contact us. Our phone numbers and email addresses remain unchanged. Once again, we appreciate your support and understanding, and we look forward to creating a brighter future together.
Shanghai SAIC Hengxu Capital Co., Ltd.
Jan. 29, 2024