2023-08-01
近日,「格创东智」正式宣布完成了数亿元人民币B轮融资。本轮融资由上汽集团旗下恒旭资本、上汽集团战略直投基金、粤财基金联合领投,资金将主要用于加大对半导体CIM(计算机集成制造系统)产品的投入,强化公司AI、大数据技术基础,拓展在装备智能化、边缘控制智能化的核心竞争力,为半导体材料、设备、晶圆制造、封装测试,以及新能源锂电、光伏等行业客户提供行业深度融合解决方案。
自2018年成立以来,格创东智便一直专注于半导体行业智能制造升级,其半导体工厂智能化CIM解决方案已在多个先进半导体工厂落地,100%自研的数据智能产品已成功帮助客户实现了从硅片、晶圆制造、封装测试、到成品组装,从多车间、到多工厂的生产管理、品质追溯和工艺优化。
目前格创东智已在新能源产业链上下游实现全覆盖,客户涉及锂电池材料、电芯、锂电池PACK以及光伏电站等多个环节,可为客户提供整厂规划、生产制造、品质检测、仓储物流等在内的新能源智能工厂CIM解决方案,助力客户在产能扩张的阶段,通过数字化、智能化手段缩短产能爬坡期,快速提升产品品质、降低制造成本。
对于本次融资,格创东智CEO何军表示:“感谢上汽集团、恒旭资本和粤财基金对格创东智的认可。我们与资方在战略目标上有高度共识,未来将不断深化战略合作、共同为半导体、新能源赛道打造顶尖的国产化工业软件和解决方案而努力。我们要不断吸引世界一流人才加入格创,一起打造半导体和新能源行业最好的CIM和智能制造产品,真正为客户、股东和社会创造价值。
恒旭资本董事长陆永涛表示:
格创东智基于TCL在大尺寸面板与半导体硅片等领域沉淀下的先进制造整体经验,形成了体系化的软硬件一体化产品,搭建了业内稀缺的成建制的规模化团队,目前在半导体晶圆制造、新能源光伏领域成就了一系列业界瞩目的成功案例,我们期待格创东智与恒旭资本携手后,在汽车行业结构性变革时代,共同开拓汽车零部件、新能源电池工厂产线的无人化、智能化提升与改造,为上汽集团与TCL的深度合作开启新的篇章。
下一篇:恒旭资本2022年10月企业动态
Change of Address Notice
Dear investors and partners,
With your ongoing care and support, Hengxu Capital has achieved significant development and progress since its establishment. In order to better meet the needs of our business operations, our office location will be relocated to 5F, Building N3, New Bund Square City, No. 2, Lane 131, Qiantan Avenue, Pudong New District, Shanghai(Map Link: https://j.map.baidu.com/b5/x7VK).
The new office space is conveniently located with excellent facilities, providing improved conditions for meetings, receptions, and work. This relocation will facilitate better communication and collaboration between Hengxu Capital and our partners, enhancing employee satisfaction and office efficiency, and laying a solid foundation for continued and rapid business development.
The new office has been officially in use since January 29, and our mailing address has been switched to the new location. Considering the approaching Chinese New Year, we will not hold a relocation ceremony at the moment but plan to invite you to visit and guide us at a suitable time in the future.
If you have any questions or concerns, please feel free to contact us. Our phone numbers and email addresses remain unchanged. Once again, we appreciate your support and understanding, and we look forward to creating a brighter future together.
Shanghai SAIC Hengxu Capital Co., Ltd.
Jan. 29, 2024