西安奕材成功在科创板上市,恒旭资本收获第17家上市企业

2025-10-28

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随着人工智能技术发展和消费电子市场回暖,半导体行业正步入上行周期,带动硅片需求增长。根据SEMI预测,全球12英寸晶圆厂产能将从2024年834万片/月提升至2027年1064万片/月,年复合增长率约为8.5%。其中国内12英寸晶圆厂产能将由2024年235万片/月提升至2027年353万片/月,占比从约28%提升至约33%。
如今,奕斯伟科技集团旗下12英寸硅片生产、Risc-V 芯片设计和面板级封装三大主业,正各自在细分领域突破半导体产业发展瓶颈,西安奕材的成功上市便是这一资本与科技人才有机结合的亮眼成果。
在这一关键赛道上,西安奕材作为新进入“挑战者”,截至2024年末,公司12英寸硅片出货量及产能规模均稳居国内第一、全球第六,月均出货量和产能规模全球占比分别约为6%和7%。
在国内市场,公司更是展现出强劲的竞争优势:不仅是国内主流存储IDM厂商全球12英寸硅片供应商中供货量前两位的企业,还是国内一线逻辑晶圆代工厂供应商中的供货量冠军,同时成为国内新建12英寸晶圆厂的首选合作伙伴。
从技术突破打破国外垄断,到客户验证构建市场壁垒,再到产能扩张抢占全球份额,西安奕材正通过上市实现跨越式发展。这家诞生于西安的硬科技企业,不仅是地方科创实力的集中体现,更将以资本为翼,加速中国半导体材料的国产化替代进程。




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关于恒旭资本
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恒旭资本(中基协备案号:P1070270)于 2019 年创立,是一家具有雄厚产业背景支撑的市场化投资机构。管理团队汇聚了来自多个领域的资深专业人士,凭借丰富的产业经验和卓越的投资能力,创造了优秀且可持续的基金业绩。股权投资聚焦硬科技、健康消费等符合国家转型和新质生产力要求的投资机会,关注要素创新、产品升级、技术外溢、颠覆创新、人口变化五大投资主题。资产并购板块重点关注风光储充等新能源基础设施领域的优质资产,致力于为投资人创造持续、稳定的回报。通过专业的投资运作和资源整合,恒旭资本积极助力产业发展,致力于成为受人信赖的一流投资机构。


恒旭资本累计管理规模已超过400亿元,投资人包括产业龙头、金融机构、国家政府、市场机构等。核心团队有丰富的产业资源,在项目管理、基金管理方面拥有丰富的经验,主导了宁德时代、地平线、通行宝、清陶能源、亚虹医药、帅克宠物、中车半导体、银河通用、东方算芯、大疆卓驭等数十个优质企业投资,陪伴企业成长为细分市场的龙头企业。

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Change of Address Notice


Dear investors and partners,


With your ongoing care and support, Hengxu Capital has achieved significant development and progress since its establishment. In order to better meet the needs of our business operations, our office location will be relocated to 5F, Building N3, New Bund Square City, No. 2, Lane 131, Qiantan Avenue, Pudong New District, Shanghai(Map Link: https://j.map.baidu.com/b5/x7VK).


The new office space is conveniently located with excellent facilities, providing improved conditions for meetings, receptions, and work. This relocation will facilitate better communication and collaboration between Hengxu Capital and our partners, enhancing employee satisfaction and office efficiency, and laying a solid foundation for continued and rapid business development.



The new office has been officially in use since January 29, and our mailing address has been switched to the new location. Considering the approaching Chinese New Year, we will not hold a relocation ceremony at the moment but plan to invite you to visit and guide us at a suitable time in the future.


If you have any questions or concerns, please feel free to contact us. Our phone numbers and email addresses remain unchanged. Once again, we appreciate your support and understanding, and we look forward to creating a brighter future together.


Shanghai SAIC Hengxu Capital Co., Ltd.


Jan. 29, 2024