2026-07-31

2026年7月29日—30日,由融中财经主办的2026(第十二届)中国科创投资夏季峰会在西安隆重启幕。会上,《融中2025-2026年度中国产业投资榜单》盛大发布。
恒旭资本荣获2025-2026年度中国人工智能领域最佳投资机构、中国集成电路与半导体领域卓越投资机构、中国未来产业领域卓越投资机构。恒旭资本董事长陆永涛先生获得2025-2026年度中国人工智能领域最佳投资人物。
恒旭资本始终坚持以产业研究为基础,围绕科技创新与产业升级开展系统化布局,重点关注人工智能、集成电路与半导体、具身智能、智能驾驶、商业航天、脑机接口、新能源材料等方向,逐步形成覆盖底层技术、核心部件与产业应用的投资体系。在人工智能领域,恒旭资本投资了银河通用、它石智航、阶跃星辰、Momenta、地平线、东方算芯等企业,覆盖大模型、算力芯片、机器人及智能驾驶等关键环节;在集成电路与半导体领域,布局长鑫科技、盛合晶微、中车半导体、西安奕材、紫光国芯等项目;同时持续关注脑玑科技、垣信卫星、新奥聚变等代表未来产业发展方向的创新企业。
面向未来,恒旭资本将继续坚持长期主义,发挥产业资本、专业团队与资源生态优势,持续发掘具有核心技术和产业价值的优质企业,陪伴科技企业成长,为投资人创造长期回报,为中国科技创新和产业升级贡献力量。











Change of Address Notice
Dear investors and partners,
With your ongoing care and support, Hengxu Capital has achieved significant development and progress since its establishment. In order to better meet the needs of our business operations, our office location will be relocated to 5F, Building N3, New Bund Square City, No. 2, Lane 131, Qiantan Avenue, Pudong New District, Shanghai(Map Link: https://j.map.baidu.com/b5/x7VK).
The new office space is conveniently located with excellent facilities, providing improved conditions for meetings, receptions, and work. This relocation will facilitate better communication and collaboration between Hengxu Capital and our partners, enhancing employee satisfaction and office efficiency, and laying a solid foundation for continued and rapid business development.
The new office has been officially in use since January 29, and our mailing address has been switched to the new location. Considering the approaching Chinese New Year, we will not hold a relocation ceremony at the moment but plan to invite you to visit and guide us at a suitable time in the future.
If you have any questions or concerns, please feel free to contact us. Our phone numbers and email addresses remain unchanged. Once again, we appreciate your support and understanding, and we look forward to creating a brighter future together.
Shanghai SAIC Hengxu Capital Co., Ltd.
Jan. 29, 2024