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恒旭新闻 | 恒旭资本荣获甲子光年「2025-2026年度中国科技产业投资榜」多项殊荣

2026-08-24

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2026年8月20日，「甲子光年」于北京举办「激流——2026甲子引力X·科技产业投资大会」，大会现场正式发布「2025-2026年度中国科技产业投资榜」。恒旭资本凭借在硬科技领域的专业投资能力与深厚产业积淀，一举斩获四项重磅荣誉。

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     三项殊荣，彰显硬科技投资实力

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2026年，中国科技投资正行至新的"激流"之中。人工智能加速重塑产业版图，硬科技持续成为资本关注的核心方向；与此同时，估值体系、退出路径与产业协同方式也在发生深刻变化。面对更快的技术迭代与更加复杂的市场环境，投资的关键已不只是追逐浪潮，更在于穿越周期、识别真正具备技术壁垒、商业潜力与长期价值的创新力量。


在此背景下，「甲子光年」携手一线投资机构、产业核心企业、科技创业者与行业观察者，共同探讨中国科技投资的新趋势、新机遇与新价值坐标。本届榜单设置投资机构&投资人榜、最具投资价值企业榜两大类别，共涵盖9大榜单、28个子榜单，聚焦人工智能、具身智能、半导体与集成电路、智能制造、医疗健康、商业航天、新能源、新材料等科技产业领域，寻找并致敬在激流中保持专业判断、坚守长期主义的投资机构、投资人和科创企业。


本届榜单中，恒旭资本分别在人工智能、半导体与集成电路、新能源三大垂直赛道及综合榜中获得行业认可：

•人工智能领域——荣登「2025-2026年度人工智能最佳投资机构TOP50」 

•半导体与集成电路领域——荣登「2025-2026年度半导体与集成电路最佳投资机构TOP40」

•新能源领域——荣登「2025-2026年度新能源最佳投资机构TOP20」

•综合榜——荣登「2025-2026年度最佳CVC科技投资机构TOP20」

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四项荣誉的获得，是行业对恒旭资本长期深耕硬科技、坚持价值投资理念的又一次高度认可，也印证了公司作为具备雄厚产业背景的市场化CVC机构，在科技产业投资领域的综合实力与赛道判断力。


激流奔涌，唯有真正的价值经得起浪潮检验。未来，恒旭资本将继续坚守长期主义与价值投资理念，深耕硬科技与新能源等战略领域，以专业的投资能力与深厚的产业积淀，陪伴更多优质创新企业成长，助力中国科技产业高质量发展。

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                                     ShangHai / ShenZhen / BeiJing
Email：scir@hengxucapital.com

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All rights reserved. Hengxu Capital Shanghai ICP Filing Number 2021018213

Asset Management Association of China Registration Number:：P1070270

Address：5th Floor, Building N3, New Bund Square City, No. 2, Lane 131, Qiantan Avenue, Pudong New District, Shanghai
                  ShangHai / ShenZhen / BeiJing
Email：scir@hengxucapital.com
All rights reserved. Hengxu Capital Shanghai ICP Filing Number 2021018213
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Change of Address Notice


Dear investors and partners,


With your ongoing care and support, Hengxu Capital has achieved significant development and progress since its establishment. In order to better meet the needs of our business operations, our office location will be relocated to 5F, Building N3, New Bund Square City, No. 2, Lane 131, Qiantan Avenue, Pudong New District, Shanghai(Map Link: https://j.map.baidu.com/b5/x7VK).


The new office space is conveniently located with excellent facilities, providing improved conditions for meetings, receptions, and work. This relocation will facilitate better communication and collaboration between Hengxu Capital and our partners, enhancing employee satisfaction and office efficiency, and laying a solid foundation for continued and rapid business development.



The new office has been officially in use since January 29, and our mailing address has been switched to the new location. Considering the approaching Chinese New Year, we will not hold a relocation ceremony at the moment but plan to invite you to visit and guide us at a suitable time in the future.


If you have any questions or concerns, please feel free to contact us. Our phone numbers and email addresses remain unchanged. Once again, we appreciate your support and understanding, and we look forward to creating a brighter future together.


Shanghai SAIC Hengxu Capital Co., Ltd.


Jan. 29, 2024