恒旭直投企业汇聚新材获国调科改基金超亿元A+轮融资

2022-02-21

近期,恒旭资本投资的MLCC企业南京汇聚新材料科技有限公司(下称“汇聚新材”)于近期完成由国调科改基金领投的超亿元A+轮融资。

恒旭此前参与投资汇聚新材的A轮融资,两轮融资相隔不到半年。本轮融资完成后, “汇聚新材”将持续完善产品结构和扩大产能,进一步研发新材料前沿技术,推动MLCC产业的国产化进程。


关于“汇聚新材”与MLCC

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“汇聚新材”成立于2016年3月,业务涵盖电子陶瓷材料及片式电子元件研发、生产和销售。 主要产品包括多层陶瓷电容(MLCC)、单层芯片电容、穿心电容、射频元件、电子陶瓷材料、电子浆料等。产品广泛应用于工业电子、汽车电子、军工电子以及信息和通信技术等领域。

MLCC(片式多层陶瓷电容)被称为“电子工业大米”,是全球用量最大的被动电子元件之一,几乎所有消费电子都要用到MLCC元器件。目前MLCC经历多年发展,全球市场格局可划分为以日本厂商为代表的第一梯队;第二梯队基本以韩国和中国台湾为代表;其次中国大陆相关企业位列第三梯队。近年来行业动荡及国际形势影响所带来的供应链不稳定,使得国产化MLCC行业迎来了新的发展机遇。

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”汇聚新材”创始人金雷表示,研发与管理团队来自国外业界大厂,且拥有超过20年的实战经验, 既具备结合材料研发(陶瓷粉配方、电子浆料)以及工程技术、组装量产以及提供应用技术服务等垂直整合管理技术,还拥有 “一种低温共烧陶瓷微波与毫米波介电粉末(CN110171963B)”“一种低温烧结陶瓷材料(CN110171972B)”等多项发明专利。

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Change of Address Notice


Dear investors and partners,


With your ongoing care and support, Hengxu Capital has achieved significant development and progress since its establishment. In order to better meet the needs of our business operations, our office location will be relocated to 5F, Building N3, New Bund Square City, No. 2, Lane 131, Qiantan Avenue, Pudong New District, Shanghai(Map Link: https://j.map.baidu.com/b5/x7VK).


The new office space is conveniently located with excellent facilities, providing improved conditions for meetings, receptions, and work. This relocation will facilitate better communication and collaboration between Hengxu Capital and our partners, enhancing employee satisfaction and office efficiency, and laying a solid foundation for continued and rapid business development.



The new office has been officially in use since January 29, and our mailing address has been switched to the new location. Considering the approaching Chinese New Year, we will not hold a relocation ceremony at the moment but plan to invite you to visit and guide us at a suitable time in the future.


If you have any questions or concerns, please feel free to contact us. Our phone numbers and email addresses remain unchanged. Once again, we appreciate your support and understanding, and we look forward to creating a brighter future together.


Shanghai SAIC Hengxu Capital Co., Ltd.


Jan. 29, 2024