芯旺微完成B轮融资3亿元_Partners_News

芯旺微完成B轮融资3亿元

2021-03-15

2021年3月10日，芯旺微电子完成B轮融资，由中芯聚源、恒旭资本、万向钱潮领投，超越摩尔、三花弘道、硅港资本、云岫资本等跟投，交易金额3亿元。

本轮融资由老股东中芯聚源、恒旭资本、超越摩尔、硅港资本继续投资，同时引入汽车产业链公司万向钱潮和三花，整合汽车上下游产业链资源，提高市场竞争力。

资金将主要用于车规芯片的研发，包括满足ASIL-D等级应用于汽车发动机和域控制器的多核MCU产品，以及射频、以太网和总线类车规产品，芯旺微电子致力成为汽车领域多方位的数字和模拟芯片供应商，同时布局汽车软件生态的建设。

Address：5th Floor, Building N3, New Bund Square City, No. 2, Lane 131, Qiantan Avenue, Pudong New District, Shanghai

Email：scir@hengxucapital.com

Change of Address Notice

Dear investors and partners,

With your ongoing care and support, Hengxu Capital has achieved significant development and progress since its establishment. In order to better meet the needs of our business operations, our office location will be relocated to 5F, Building N3, New Bund Square City, No. 2, Lane 131, Qiantan Avenue, Pudong New District, Shanghai(Map Link: https://j.map.baidu.com/b5/x7VK).

The new office space is conveniently located with excellent facilities, providing improved conditions for meetings, receptions, and work. This relocation will facilitate better communication and collaboration between Hengxu Capital and our partners, enhancing employee satisfaction and office efficiency, and laying a solid foundation for continued and rapid business development.

The new office has been officially in use since January 29, and our mailing address has been switched to the new location. Considering the approaching Chinese New Year, we will not hold a relocation ceremony at the moment but plan to invite you to visit and guide us at a suitable time in the future.

If you have any questions or concerns, please feel free to contact us. Our phone numbers and email addresses remain unchanged. Once again, we appreciate your support and understanding, and we look forward to creating a brighter future together.

Shanghai SAIC Hengxu Capital Co., Ltd.

Jan. 29, 2024