芯旺微电子入选2020中国IC独角兽企业_Partners_News

芯旺微电子入选2020中国IC独角兽企业

2021-06-21

近日，以“创新求变，同芯共赢”为主题的2021世界半导体大会在南京盛大开幕，为激励我国具有市场竞争力和投资价值的集成电路企业健康快速发展，挖掘中国集成电路领域的优秀创新企业，提升中国企业的国际和国内影响力，2020年度中国IC独角兽评选结果及颁奖仪式在大会期间同步举行。恒旭资本被投企业芯旺微电子凭借在汽车、工业、AIoT领域优异的市场表现，成功入选2020中国IC独角兽企业。

芯旺微电子自成立以来，秉承”坚守品质持续创新”的发展理念，一直专注基于自主KungFu内核MCU产品的研发设计，拥有十多年的汽车市场芯片产品研发经验和市场服务经验。基于KungFu内核的MCU凭借优异的系统性能和稳定性，已应用于全球多家世界五百强和国内知名企业，累计出货超数亿颗。

Address：5th Floor, Building N3, New Bund Square City, No. 2, Lane 131, Qiantan Avenue, Pudong New District, Shanghai

Email：scir@hengxucapital.com

Change of Address Notice

Dear investors and partners,

With your ongoing care and support, Hengxu Capital has achieved significant development and progress since its establishment. In order to better meet the needs of our business operations, our office location will be relocated to 5F, Building N3, New Bund Square City, No. 2, Lane 131, Qiantan Avenue, Pudong New District, Shanghai(Map Link: https://j.map.baidu.com/b5/x7VK).

The new office space is conveniently located with excellent facilities, providing improved conditions for meetings, receptions, and work. This relocation will facilitate better communication and collaboration between Hengxu Capital and our partners, enhancing employee satisfaction and office efficiency, and laying a solid foundation for continued and rapid business development.

The new office has been officially in use since January 29, and our mailing address has been switched to the new location. Considering the approaching Chinese New Year, we will not hold a relocation ceremony at the moment but plan to invite you to visit and guide us at a suitable time in the future.

If you have any questions or concerns, please feel free to contact us. Our phone numbers and email addresses remain unchanged. Once again, we appreciate your support and understanding, and we look forward to creating a brighter future together.

Shanghai SAIC Hengxu Capital Co., Ltd.

Jan. 29, 2024