高诚生物完成7500万美元D轮融资,用于加速创新管线品种推进

2021-06-17

恒旭资本被投企业高诚生物完成7500万美元D轮融资,用于加速创新管线品种推进,其中包括两个领先的肿瘤免疫领域项目,并将在临床试验中验证公司独特的药物智能科学(DISTM)平台技术。本轮融资由Mirae Asset Financial Group领投,波士顿投资集团和其它新进投资方,以及IDG、红杉、恒旭资本等现有投资者共同参与。

image.png

高诚生物将利用本轮融资所获资金推进两款领先的抗肿瘤创新抗体品种进入I期临床试验——HFB200301(针对TNFR2靶点的创新抗体)和HFB301001(差别化的针对OX-40靶点的二代创新抗体)。公司将利用其整合了深厚的疾病生物学专业知识、单细胞科学以及先进的数据智能工具的DISTM平台,提高这两项以及未来其它临床试验的成功率。此外,公司将进一步通过早期发现和临床试验推进多个管线品种。
  
高诚生物总裁兼CEO仲倞(Liang Schweizer)博士表示:“自上一轮融资以来,公司达成了多项重大的里程碑,包括快速开发HFB30132A(SARS-CoV-2中和抗体)并在美国进入I期临床试验(NCT04590430),以及成功启动针对多个新型肿瘤免疫靶点的抗体项目的临床前研究和CMC生产。此外,我们始终致力于发展我们先进的DISTM平台,用于确定疾病高相关性靶点,发现高质量抗体疗法以及在临床实践中验证我们对生物标志物的假设。非常感谢来自全球专业投资机构的支持,他们与我们的理念产生共鸣,希望公司持续提升强大的药物早期发现和临床开发引擎。”
  
本轮融资后,来自Mirae Asset Financial Group的Ryan Jeong将加入公司董事会。Ryan表示:“Mirae Asset Financial Group致力于投资生命科学行业突破性的理念和创新团队。高诚生物近些年达成了多项成功的外部合作,并展示了快速推进可持续的创新疗法产品管线的能力。我们很高兴能够支持高诚生物继续开拓免疫疗法的征程,并将惠及每一位患者。”
  
恒旭资本董事长陆永涛表示:“高诚生物基于先进的DISTM平台,用于筛选疾病高相关性靶点,发现高质量的抗体疗法药物。公司开发的HFB30132A(SARS-CoV-2中和抗体)已在美国进入I期临床试验,验证了平台早期研发能力。我们很高兴能够继续支持高诚生物,伴随公司砥砺前行,为更多患者带来希望。”
Top

Change of Address Notice


Dear investors and partners,


With your ongoing care and support, Hengxu Capital has achieved significant development and progress since its establishment. In order to better meet the needs of our business operations, our office location will be relocated to 5F, Building N3, New Bund Square City, No. 2, Lane 131, Qiantan Avenue, Pudong New District, Shanghai(Map Link: https://j.map.baidu.com/b5/x7VK).


The new office space is conveniently located with excellent facilities, providing improved conditions for meetings, receptions, and work. This relocation will facilitate better communication and collaboration between Hengxu Capital and our partners, enhancing employee satisfaction and office efficiency, and laying a solid foundation for continued and rapid business development.



The new office has been officially in use since January 29, and our mailing address has been switched to the new location. Considering the approaching Chinese New Year, we will not hold a relocation ceremony at the moment but plan to invite you to visit and guide us at a suitable time in the future.


If you have any questions or concerns, please feel free to contact us. Our phone numbers and email addresses remain unchanged. Once again, we appreciate your support and understanding, and we look forward to creating a brighter future together.


Shanghai SAIC Hengxu Capital Co., Ltd.


Jan. 29, 2024