景略半导体(JLSemi)完成数亿元B轮系列融资

2021-08-26

近日,恒旭资本被投企业JLSemi景略半导体(领先的网络通信芯片设计公司)宣布完成数亿元B轮系列(B+/B++)融资。继2020年恒旭资本战投A+轮之后,持续得到⼀线基⾦的⻘睐和加持。

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JLSemi景略半导体在上海、南京、深圳等六地设有研发和运维中心。团队技术背景深厚,在模拟、DSP、SoC和混合信号设计领域具行业领先地位,是全球少数几家拥有100%自研IP的车载单对线千兆1000BASE-T1和标准万兆10G-BASE-T物理层传输PHY技术的芯片设计公司。

自2020年起,公司陆续推出Antelope™工业系列以太网PHY,Cheetah™车载系列以太网PHY和SailFish™数通系列Switch产品组合,2021年芯片出货量已达数千万颗,为多个行业的一线客户提供高性价比的产品和卓越的服务。

JLSemi景略半导体联合创始人、董事长兼CEO何润生博士表示:“B轮系列融资极具战略意义,将助力我们深度布局车载和工业赛道,为产业链上下游提供高速数据链接,数据交换和数据处理的系统解决方案,同时提升供应链的多样化和安全性,为合作伙伴创造战略价值。JLSemi团队依托在高速网络接口和通信芯片领域的深度积累,沿着OSI的7层网络框架,从技术门槛最高的物理层开始,坚持自研IP和先进工艺,陆续推出基于创新性的EtherNext™高速物理层接口PHY架构和BlueWhale™ 新一代L2/L2+ Switch技术的芯片产品组合。非常感谢产业链上下游领先企业对我们的高度认可和信任,我们将再接再厉,加速产品线的拓展和技术迭代,继续领跑车载和工业网络通信芯片的赛道。”

恒旭资本董事长陆永涛表示:“全球汽⻋⾏业正在经历⼀场巨⼤的变⾰,电动化,⾃动驾驶,软件定义等新技术正在加速汽⻋电⼦/电⽓架构的⾰命性发展,未来的汽⻋将是⼀个移动的数据中⼼。作为⻋载⽹络的⻣⼲⽹,⻋载以太⽹的崛起将创造出⼀个百亿美元规模的芯⽚市场。JLSemi团队在⾼速数据传输和⽹络芯⽚技术上有着深厚的底蕴,是国内⾸家具备成熟千兆带宽以上⻋载以太⽹物理层接⼝芯⽚技术的公司,恒旭资本作为上汽背景的产业投资机构,选择与JLSemi合作,具有战略意义。”

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Change of Address Notice


Dear investors and partners,


With your ongoing care and support, Hengxu Capital has achieved significant development and progress since its establishment. In order to better meet the needs of our business operations, our office location will be relocated to 5F, Building N3, New Bund Square City, No. 2, Lane 131, Qiantan Avenue, Pudong New District, Shanghai(Map Link: https://j.map.baidu.com/b5/x7VK).


The new office space is conveniently located with excellent facilities, providing improved conditions for meetings, receptions, and work. This relocation will facilitate better communication and collaboration between Hengxu Capital and our partners, enhancing employee satisfaction and office efficiency, and laying a solid foundation for continued and rapid business development.



The new office has been officially in use since January 29, and our mailing address has been switched to the new location. Considering the approaching Chinese New Year, we will not hold a relocation ceremony at the moment but plan to invite you to visit and guide us at a suitable time in the future.


If you have any questions or concerns, please feel free to contact us. Our phone numbers and email addresses remain unchanged. Once again, we appreciate your support and understanding, and we look forward to creating a brighter future together.


Shanghai SAIC Hengxu Capital Co., Ltd.


Jan. 29, 2024